The implementation of innovative processes for high-speed monitoring, control and cleaning of printed circuit boards with a high saturation density of electronic components with ultra-fine pitch such as 01005 or 008004
With the implementation of the current present project, we will implement in our existing production practice an innovative process leading to the assembly of miniature electronic components on printed circuit boards, intended for use in various fields of the electronic industry.
The nature of this innovative process is high-speed monitoring, control, test and cleaning of high-density assembled PCB with ultra-fine pitch electronic components such as 01005 or 008004. The process includes the following steps:
- 3D quality control of the process of applying soldering paste to pads for miniature electronic components;
- In-circuit testing of assembled modules quality via flying probes;
- cleaning, in order to prevent non-conformities in quality requirements, prevent electrical short circuits, corrosion, dendritic structures and others that would be caused by the accumulation of contamination.
